Micro Bump Switch Contact Points
Example Application: Replacement for Pogo Pins Socket Assemblies
E-FAB has the capabilities to produce precision formed micro bumps for miniature switch contacts, IC test socket contacts, individual formed spring contacts (compliant set of contacts for multiple contact points on uneven surfaces), or electrically isolated test pins and other contact point applications such as replacements for pogo pin probes in test socket assemblies.
Pictured above is a grid array of micro contacts. Individual micro contacts can be manufactured to a customer’s specifications on individual circuit traces and pads to provide electrically isolated points. E-FAB contact points can be built at any point along a trace to provide the exact contact point location required for your application.
Using E-FAB’s precision photo chemical machining and our micro bump forming process, we have the ability to produce precision bumps on various metals and alloys. If you are in need of a special application for electrical contact bumps, miniature contact points, spring contacts on thin metal parts, raised contact points on stand-alone trace circuits or even spring loaded flex circuits, E-FAB can manufacture it to your specifications.
An Example Application
E-FAB’s contact point assemblies have been used to replace pogo pins in test sockets. Much like pogo pin probes and socket assemblies with spring action and individually isolated electrical contact points, E-FAB’s micro contacts have been used as electrically isolated contact points with built-in spring action. E-FAB’s contact point assemblies are engineered to each customer’s specifications and have etched break-off tabs built into the assemblies. Once the contact point assemblies are installed into their matching test sockets, the metal tabs (the portion of the metal frame holding all the pins in a fixed pattern is a type of lead frame) are then easily snapped off at the etch lines, providing separate electrical isolation for each contact leg for testing of individual contact points on the chip or board surface. E-FAB’s micro contact point assemblies can save a customer money as compared to the use of pogo pins in building socket fixtures for testing machines.
E-FAB can produce precision micro bumps for all types of applications. Micro bumps can be heat treated in order to provide hardened contact points. They can also be gold plated or plated with other types of metals or alloys. In addition to precision bump protrusions (contacts), if you need micro divots, cavities, depressions, or precision dimples in thin metal parts and flex circuit traces, E-FAB can do that too.
Contact E-FAB today.
Pictured on the left is a close-up view of the .005 inch (0.127 mm) diameter precision formed micro bumps. Micro bumps can be heat treated in order to provide hardened contact points. Contacts can be gold plated or plated with other metals in order to provide long lasting switch contacts. Applications for these micro bumps and/or micro dimples in thin metal parts, circuits, and OEM products abound, and only are limited by engineering imagination.
Contact our engineers with your engineering specifications and we can start manufacturing your precision parts today. E-FAB provides a wealth of engineering support and technical knowledge to help you plan for optimum parts designs.
Contact our engineering and sales team today for micro contacts, micro bumps parts quote.
Pictured on the right is the actual size (note this is not a thumbnail view) of the formed micro bump socket. With E-FAB’s precision photo chemical machining, photo etching, and micro chemical milling, capabilities we produce precision thin metal parts for a wide variety of technology applications and industries. When it comes to small thin metal parts fabrication or large format etched designs, E-FAB can build it for you.
Contact E-FAB today for more information.
Stiffen up your circuit boards today, carry extra current on the bus, get E-FAB PCB stiffeners and busbars for a more powerful and longer PCB life.