Direct Bonded Copper (DBC) High Power Performance Matching Thermal Coefficient of Expansion (TCE)

Directly Bonded Copper Applications

Break-thru in packaging high power copper bonding semiconductor die

 DBC Advantages for your Power Designs:

  • Allows higher power distribution area
  • The TCE match with silicon is improved
  • Superior heat sinking dissipation (a lower thermal resistance)
  • Excellent conductivity
  • Good mechanical strength
  • Environmentally clean
  • Excellent electrical insulation (25 kv over 1 minute)

Heat sinking with thru-hole connections

 How to use DBC for High Power Performance:

  • “Chip-on-board” technology (allows tighter packaging of modules, thus providing greater design flexibility)
  • Motor controls applications
  • Semiconductor and hybrid semiconductors.
  • Various types of control circuits.

Imagine the possibilities of using Cu bonding for your application.

We have the staff in place for helping in the engineering, design, and production phases of your projects. We will gladly take the time to evaluate your manufacturing needs. Contact E-FAB for more information about this product. We offer prompt delivery, superior quality, prototypes, and development projects are welcome. E-fab Inc. 1075 Richard Ave., Santa Clara, California. 800.600.3322.

Some of the industries served by E-FAB include: aerospace, antennas, communications, computer, electronic, flex circuits, hybrid, and rigid flexible circuits, interconnect, laser, dental medical instrumentation, microwave, military, ordinance, optical, PCB, RFID, RF, microwave antennas, tactical, weapons systems, and other high tech technology OEMs.

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