E-Fab Photo Chemical Machining News


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Micro Bump Switch Contact Points

E-FAB has the capabilities to produce precision formed micro bumps for miniature switch contacts, IC test socket contacts, and other contact point applications.

IC Test Sockets

With E-FAB's precision photo chemical machining, and our micro bump forming process, we have the ability to produce precision bumps on various metals and alloys. Are you in need of a special application for bumps or miniature contact points on thin metal parts? Contact E-FAB today with your engineering specifications and we can help design it for you.

Precision Formed Micro BumpsPictured on the left is a close-up view of the .005 inch (0.127 mm) diameter precision formed micro bumps. Micro bumps can be heat treated in order to provide hardened contact points. Contacts can be gold plated or plated with other metals in order to provide long lasting switch contacts.

Contact our engineers with your engineering specifications and we can start manufacturing your precision parts today. E-FAB provides a wealth of engineering support and technical knowledge to help you plan for optimum parts designs.

Contact our engineering and sales team today for a parts quote.

IC Test Socket Micro Bumps Contact PointsPictured on the right is the actual size (not a thumbnail view) of the formed micro bump socket. With E-FAB's precision photo chemical machining and etching capabilities we produce precision thin metal parts for a wide variety of technology applications and industries. When it comes to small thin metal parts fabrication or large format etched designs, E-FAB can build it for you.

Contact E-FAB today for more information.

E-FAB provides products for a diverse group of industries including: military, medical, dental, optical, NASA, PCB industries (rigid, flex, and rigid-flex printed circuit boards), aerospace products, communications, computers, electronic equipment, EMI technologies, hybrid circuits, Interconnect assemblies, laser, instrumentation, ordinance, power semiconductor, semiconductors, RFID microwave antenna, stacked memory arrays, interconnect modules, tactical, weapons systems, and other high tech OEM technology companies.

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Precision Formed Metal Parts

Precision Photo Chemical Machining